{"product_id":"2uul-bg03-0-12mm-cpu-bga-reballing-stencil-for-iphone-17-series","title":"2UUL BG03 0.12mm CPU BGA Reballing Stencil for iPhone 17 Series","description":"1. Precision 0.12mm Design: Features 0.12mm pinholes, perfectly suited for iPhone 17 Series CPU BGA reballing.\u003cbr\u003e2. High-Accuracy Reballing Tool: Nickel-plated steel stencil ensures precise solder ball placement, improving soldering success rates.\u003cbr\u003e3. Durable Material: Made from high-quality wear-resistant steel, heat-resistant and deformation-free, suitable for repeated use.\u003cbr\u003e4. Professional Repair Tool: Designed for technicians and professional repair shops, improving CPU BGA chip replacement and repair efficiency.\u003cbr\u003e5. Wide Compatibility: Compatible with iPhone 17 Series CPU\/BGA reballing applications.\u003cbr\u003e6. Enhances Soldering Efficiency: Accurate hole placement minimizes solder ball displacement, reduces rework, and increases workflow efficiency.\u003cbr\u003e\u003cbr\u003e","brand":"Phonesmark","offers":[{"title":"Default Title","offer_id":52310444507477,"sku":"EDA0089904","price":13.95,"currency_code":"EUR","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0832\/3727\/3941\/files\/EDA0089904.jpg?v=1769095446","url":"https:\/\/phonesmark.com\/products\/2uul-bg03-0-12mm-cpu-bga-reballing-stencil-for-iphone-17-series","provider":"Phonesmark","version":"1.0","type":"link"}